PACE ThermoFlo Systems TF 1700 BGA Rework System

PACE’s ThermoFlo TF 1700 rework systems are the next generation in semi-automated, cost effective solutions for area array package and SMD rework. No other systems on the market have the advanced features found on these systems or are easier to use, ensuring operator acceptance and success! Designed for today’s PCBs, ThermoFlo Systems can safely install and remove a wide variety of CSPs, FCs, PBGAs, CBGAs, MLFs, LCCs, QFNs, and other SMDs. The PC based software is so advanced that creating profiles has never been easier! The PC software guides the operator through an intuitive interface that virtually automates the process.
All operations: component pickup, alignment, placement, and reflow are completed in a single axis, eliminating the risk of component movement after placement. The software has been specifically designed with the rework process in mind and integrates the inspection process and record keeping as well as the ability to generate reports in user friendly PDF files.